Home > Hybrid PCB > Hybrid RF and High Frequency 4-Layer Circuit Boards Built on 16mil RO4003C + FR-4 with Immersion Tin
Hybrid RF and High Frequency 4-Layer Circuit Boards Built on 16mil RO4003C + FR-4 with Immersion Tin

(Printed Circuit Boards are custom-made products; the images and parameters shown are for reference only.)


Introduction

Hello Everyone,
Today, we will discuss two types of 4-layer high frequency PCBs constructed with a 16mil core of RO4003C.


The design features a 4-layer structure, which is relatively simple and cost-effective, making it ideal for entering new markets.


Stack-Up Overview

Let’s examine the stack-up first.


In the stack-up, the first and second layers consist of a 12mil core of RO4003C, while the third and fourth layers use a 16mil core of RO4003C. The fixed thickness of the core is crucial for maintaining the electrical length of RF lines on the circuit board. The two cores are bonded using bonding film (Prepreg).


Currently, two types of prepreg are used in multilayer high frequency PCBs: FR-4 dielectric and high frequency dielectrics, such as RO4450F, Cuclad 6250, and Taconic’s FastRise-28 (FR-28).


The copper weight on the inner layer is 0.5 ounces, while the outer layers are 1 ounce. Blind vias are drilled through both cores.



The second board is a mixed PCB, utilizing FR-4 for layers three and four, while high frequency signals transmit through the high frequency substrate in layers one and two. The thickness of the dielectric material and FR-4 can be adjusted according to specific applications.


Applications

The 16mil RO4003C hybrid PCB has diverse applications, including:modular oscilloscopes;antenna combiners;balanced amplifiers;4G antennas.



Advantages

The advantages of the 16mil RO4003C hybrid PCB include:

1.Stable Dielectric Constant: RO4003C maintains a stable dielectric constant across a broad frequency range, making it an excellent substrate for broadband applications.
2.Reduced Signal Loss: It minimizes signal loss in high frequency applications, meeting the evolving demands of communication technology.
3.Cost-Effectiveness: The cost is lower compared to stack-ups using all low-loss materials.


Standard Thickness Options

The standard thicknesses available for RO4003C are 0.008” (0.203mm), 0.012” (0.305mm), 0.016” (0.406mm), 0.020” (0.508mm), 0.032” (0.813mm), and 0.060” (1.524mm). These thicknesses are readily available in-house. We welcome your inquiries and patronage.


For more detailed specifications, please refer to the Data Sheet of Rogers 4003C (RO4003C).

Data Sheet of ROgers 4003C(RO4003C)

Click to expand/collapse the table

RO4003C Typical Value

Property

RO4003C

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

3.38±0.05

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant,εDesign

3.55

Z

 

8 to 40 GHz

Differential Phase Length Method

Dissipation Factortan,δ

0.0027
0.0021

Z

 

10 GHz/23℃
2.5 GHz/23℃

IPC-TM-650 2.5.5.5

Thermal Coefficient of ε

+40

Z

ppm/℃

-50℃to 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

1.7 x 1010

 

MΩ.cm

COND A

IPC-TM-650 2.5.17.1

Surface Resistivity

4.2 x 109

 

COND A

IPC-TM-650 2.5.17.1

Electrical Strength

31.2(780)

Z

Kv/mm(v/mil)

0.51mm(0.020")

IPC-TM-650 2.5.6.2

Tensile Modulus

19,650(2,850)
19,450(2,821)

X
Y

MPa(ksi)

RT

ASTM D 638

Tensile Strength

139(20.2)
100(14.5)

X
Y

MPa(ksi)

RT

ASTM D 638

Flexural Strength

276
(40)

 

MPa
(kpsi)

 

IPC-TM-650 2.4.4

Dimensional Stability

<0.3

X,Y

mm/m
(mil/inch)

after etch+E2/150℃

IPC-TM-650 2.4.39A

Coefficient of Thermal Expansion

11
14
46

X
Y
Z

ppm/℃

-55℃to288℃

IPC-TM-650 2.4.41

Tg

>280

 

℃ TMA

A

IPC-TM-650 2.4.24.3

Td

425

 

℃ TGA

 

ASTM D 3850

Thermal Conductivity

0.71

 

W/M/oK

80℃

ASTM C518

Moisture Absorption

0.06

 

%

48hrs immersion 0.060"
sample Temperature 50℃

ASTM D 570

Density

1.79

 

gm/cm3

23℃

ASTM D 792

Copper Peel Stength

1.05
(6.0)

 

N/mm
(pli)

after solder float 1 oz.
EDC Foil

IPC-TM-650 2.4.8

Flammability

N/A

 

 

 

UL 94

Lead-free Process Compatible

Yes

 

 

 



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